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Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart
MMF301501

MMF301501

450-20R SOLDER TIN-ANTIMONY, 1 P

Micro-Measurements (Division of Vishay Precision Group)
2,112 -

RFQ

MMF301501

Технические

Spool - Active Wire Solder Sn95Sb5 (95/5) 0.020 (0.51mm) 450 ~ 460°F (232 ~ 238°C) Rosin Activated (RA) 24 AWG, 25 SWG - Lead Free Spool, 1 lb (454 g) - -
MMF006619

MMF006619

361A-20R-25 SOLDER TIN-LEAD-ANTI

Micro-Measurements (Division of Vishay Precision Group)
3,038 -

RFQ

MMF006619

Технические

Bulk - Active Wire Solder Sn63Pb36.65Sb0.35 (63/36.65/0.35) 0.020 (0.51mm) 361°F (183°C) Rosin Activated (RA) 24 AWG, 25 SWG - Leaded Spool - -
MMF006622

MMF006622

361-40R SOLDER TIN-LEAD, 1 LB

Micro-Measurements (Division of Vishay Precision Group)
2,259 -

RFQ

MMF006622

Технические

Bulk - Active Wire Solder Sn63Pb37 (63/37) 0.040 (1.02mm) 361°F (183°C) Rosin Activated (RA) 18 AWG, 19 SWG - Leaded Spool, 1 lb (454 g) - -
MMF006620

MMF006620

361A-20R SOLDER TIN-LEAD-ANTIMON

Micro-Measurements (Division of Vishay Precision Group)
3,789 -

RFQ

MMF006620

Технические

Bulk - Active Wire Solder Sn63Pb36.65Sb0.35 (63/36.65/0.35) 0.020 (0.51mm) 361°F (183°C) Rosin Activated (RA) 24 AWG, 25 SWG - Leaded Spool, 1 lb (454 g) - -
MMF006630

MMF006630

1240-FPA SILVER SOLDER PASTE --

Micro-Measurements (Division of Vishay Precision Group)
2,602 -

RFQ

MMF006630

Технические

Jar - Active Solder Paste Ag40Cu30Zn28Ni2 (40/30/28/2) - 1220 ~ 1435°F (660 ~ 780°C) - - - Lead Free Jar, 1 oz (28g) 9 Months Date of Manufacture
1500+
1500+ Ежедневный
20,000.000
20,000.000 Продукты
1800+
1800+ производители
15,000+
15,000+ Складские запасы
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