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Тепловое - Радиаторы

Мфр. Часть #	Доступность	Цена	Количество	Технические	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSS-B20-0635H-01 HEATSINK TO-220 2.7W ALUMINUM CUI Devices	1,923	-	RFQ	Технические	Bag	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.520 (13.20mm)	0.375 (9.53mm)	-	0.748 (19.00mm)	2.7W @ 75°C	9.51°C/W @ 200 LFM	27.78°C/W	Aluminum
HSE-B2111-038 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	15,339	-	RFQ	Технические	Box	HSE	Active	Board Level	Bolt On	Rectangular, Fins	0.984 (25.00mm)	0.625 (16.00mm)	-	0.354 (9.00mm)	3.8W @ 75°C	6.12°C/W @ 200 LFM	19.74°C/W	Aluminum Alloy
HSS-B20-NP-12 HEATSINK TO-220 6.8W ALUMINUM CUI Devices	1,416	-	RFQ	Технические	Bag	HSS	Active	Board Level	Bolt On	Rectangular, Fins	1.450 (36.83mm)	0.700 (17.80mm)	-	0.850 (21.60mm)	6.8W @ 75°C	3.47°C/W @ 200 LFM	14.33°C/W	Aluminum
HSB02-101007 HEAT SINK, BGA, 10 X 10 X 7 MM CUI Devices	3,512	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.394 (10.00mm)	0.394 (10.00mm)	-	0.275 (7.00mm)	2.0W @ 75°C	16.50°C/W @ 200 LFM	37.90°C/W	Aluminum Alloy
HSB03-141406 HEAT SINK, BGA, 14 X 14 X 6 MM CUI Devices	3,393	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.551 (14.00mm)	0.551 (14.00mm)	-	0.236 (6.00mm)	2.1W @ 75°C	15.80°C/W @ 200 LFM	35.98°C/W	Aluminum Alloy
HSB12-272706 HEAT SINK, BGA, 27 X 27 X 6 MM CUI Devices	1,713	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.063 (27.00mm)	1.063 (27.00mm)	-	0.236 (6.00mm)	3.8W @ 75°C	7.80°C/W @ 200 LFM	19.59°C/W	Aluminum Alloy
HSS10-B20-P40 HEAT SINK, STAMPING, TO-220, 29. CUI Devices	2,894	-	RFQ	Технические	Box	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular	1.180 (29.97mm)	1.000 (25.40mm)	-	0.500 (12.70mm)	4.1W @ 75°C	7.90°C/W @ 200 LFM	18.12°C/W	Aluminum Alloy
HSB03-121218 HEAT SINK, BGA, 12 X 12 X 18 MM CUI Devices	1,743	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.472 (12.00mm)	0.472 (12.00mm)	-	0.709 (18.00mm)	3.1W @ 75°C	9.60°C/W @ 200 LFM	24.01°C/W	Aluminum Alloy
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM CUI Devices	5,594	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.906 (23.00mm)	0.906 (23.00mm)	-	0.394 (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy
HSE-B20254-035H HEAT SINK, EXTRUSION, TO-220,25. CUI Devices	1,455	-	RFQ	Технические	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.000 (25.40mm)	1.375 (34.93mm)	-	0.500 (12.70mm)	5.8W @ 75°C	3.28°C/W @ 200 LFM	12.93°C/W	Aluminum Alloy
HSE-B250-04H HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	2,558	-	RFQ	Технические	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	0.984 (25.00mm)	1.378 (35.00mm)	-	1.000 (25.40mm)	8.0W @ 75°C	3.26°C/W @ 200 LFM	13.60°C/W	Aluminum Alloy
HSS03-B20-P318 HEAT SINK, STAMPING, TO-220, 41. CUI Devices	1,944	-	RFQ	Технические	Box	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular	1.640 (41.66mm)	1.300 (33.02mm)	-	0.470 (11.94mm)	5.5W @ 75°C	5.60°C/W @ 200 LFM	13.67°C/W	Aluminum Alloy
HSB11-252518 HEAT SINK, BGA, 25 X 25 X 18 MM CUI Devices	1,506	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.984 (25.00mm)	0.984 (25.00mm)	-	0.709 (18.00mm)	5.5W @ 75°C	4.50°C/W @ 200 LFM	13.70°C/W	Aluminum Alloy
HSS01-B20-CP HEAT SINK, STAMPING, TO-220, 49. CUI Devices	1,266	-	RFQ	Технические	Box	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular	1.941 (49.31mm)	1.900 (48.26mm)	-	0.950 (24.13mm)	9.9W @ 75°C	3.70°C/W @ 200 LFM	7.59°C/W	Aluminum Alloy
HSB14-353518 HEAT SINK, BGA, 35 X 35 X 18 MM CUI Devices	1,091	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.378 (35.00mm)	1.378 (35.00mm)	-	0.709 (18.00mm)	8.4W @ 75°C	3.60°C/W @ 200 LFM	8.97°C/W	Aluminum Alloy
HSB16-404018 HEAT SINK, BGA, 40 X 40 X 18 MM CUI Devices	1,262	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.575 (40.00mm)	1.575 (40.00mm)	-	0.709 (18.00mm)	9.4W @ 75°C	2.60°C/W @ 200 LFM	7.96°C/W	Aluminum Alloy
HSB17-404025 HEAT SINK, BGA, 40 X 40 X 25 MM CUI Devices	180	-	RFQ	Технические	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.575 (40.00mm)	1.575 (40.00mm)	-	0.984 (25.00mm)	11.7W @ 75°C	2.10°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy
HSB28-606022 HEAT SINK, BGA, 60 X 60 X 22 MM CUI Devices	234	-	RFQ	Технические	Box	HSB	Active	-	-	-	-	-	-	-	-	-	-
HSS-B20-065V-02 HEATSINK TO-220 2.9W ALUMINUM CUI Devices	1,784	-	RFQ	Технические	Bag	HSS	Active	Board Level	PC Pin	Rectangular, Fins	0.748 (19.00mm)	0.504 (12.80mm)	-	0.500 (12.70mm)	2.9W @ 75°C	7.24°C/W @ 200 LFM	25.92°C/W	Aluminum
HSS-B20-061H HEATSINK TO-220 4W ALUMINUM CUI Devices	2,127	-	RFQ	Технические	Box	HSS	Active	Board Level	PC Pin	Rectangular, Fins	1.500 (38.10mm)	0.504 (12.80mm)	-	0.500 (12.70mm)	4.0W @ 75°C	5.01°C/W @ 200 LFM	18.63°C/W	Aluminum