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Осцилляторы
| Фото: | Мфр. Часть # | Доступность | Цена | Количество | Технические | Package/Case | Packaging | Series | ProductStatus | BaseResonator | Type | Frequency | Function | Output | Voltage-Supply | FrequencyStability | AbsolutePullRange(APR) | OperatingTemperature | SpreadSpectrumBandwidth | Current-Supply(Max) | Ratings | MountingType | Size/Dimension |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DSC6101MI2B-006.1679MEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
3,938 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 6.1679 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6101MI2B-006.1679TMEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
2,991 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 6.1679 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6101ML2B-072.0000MEMS OSC ULP LVCMOS -40C-105C 25 Microchip Technology |
3,142 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 72 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6101ML2B-072.0000TMEMS OSC ULP LVCMOS -40C-105C 25 Microchip Technology |
2,735 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 72 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6101ML3B-014.7456MEMS OSC ULP LVCMOS -40C-105C 20 Microchip Technology |
2,252 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 14.7456 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6101ML3B-014.7456TMEMS OSC ULP LVCMOS -40C-105C 20 Microchip Technology |
3,055 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 14.7456 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6101ML3B-016.6666MEMS OSC ULP LVCMOS -40C-105C 20 Microchip Technology |
2,517 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 16.6666 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6101ML3B-016.6666TMEMS OSC ULP LVCMOS -40C-105C 20 Microchip Technology |
3,423 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 16.6666 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
DSC6102HL2B-072.5000MEMS OSC ULP LVCMOS -40C-105C 25 Microchip Technology |
3,561 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 72.5 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6102HL2B-072.5000TMEMS OSC ULP LVCMOS -40C-105C 25 Microchip Technology |
3,536 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 72.5 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6102MI2B-125K000MEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
3,000 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 125 kHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6102MI2B-125K000TMEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
2,389 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 125 kHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6111HA2B-024.0000MEMS OSC ULP LVCMOS -40C-125C 25 Microchip Technology |
2,946 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HA2B-024.0000TMEMS OSC ULP LVCMOS -40C-125C 25 Microchip Technology |
3,564 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HA3B-024.0000MEMS OSC ULP LVCMOS -40C-125C 20 Microchip Technology |
2,982 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HA3B-024.0000TMEMS OSC ULP LVCMOS -40C-125C 20 Microchip Technology |
2,215 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HL1B-032K768MEMS OSC ULP LVCMOS -40C-105C 50 Microchip Technology |
2,133 | - |
RFQ |
Технические |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HL1B-032K768TMEMS OSC ULP LVCMOS -40C-105C 50 Microchip Technology |
2,017 | - |
RFQ |
Технические |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111JI2B-100K000MEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
3,688 | - |
RFQ |
Технические |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 100 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-100K000TMEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
2,390 | - |
RFQ |
Технические |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 100 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
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