Больше категорий товаров

Прямоугольные разъемы - Прокладки для платы, Стеки (Плата к плате)

Мфр. Часть #	Доступность	Цена	Количество	Технические	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54111-403040850LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,624	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.196 (4.978mm)	0.335 (8.500mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-108031650LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2,808	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.156 (3.950mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54111-810031800LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3,974	-	RFQ	Технические	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	1.125 (28.575mm)	0.322 (8.179mm)	0.709 (18.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-419041650LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,100	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.882 (22.400mm)	0.112 (2.845mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-403031000LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3,579	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.112 (2.845mm)	0.394 (10.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
861400061YD1787LF CONN HDR 6POS 0.100 STACK T/H Amphenol ICC (FCI)	3,414	-	RFQ		Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	-	-	-	-	Through Hole	Kinked Pin, Solder	Gold	-
54121-109031550LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3,222	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.294 (7.468mm)	0.610 (15.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-407081550LF CONN HDR STACK Amphenol ICC (FCI)	2,830	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54121-421042600LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,486	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.266 (32.150mm)	0.122 (3.100mm)	1.024 (26.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-393R03LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3,938	-	RFQ	Технические	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.515 (13.081mm)	0.130 (3.300mm)	0.256 (6.500mm)	0.130 (3.300mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-404020700LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,234	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.660 (16.764mm)	0.264 (6.700mm)	0.276 (7.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54111-803020800LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	3,353	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.217 (5.500mm)	0.315 (8.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54111-406041500LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,065	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.744 (18.900mm)	0.059 (1.500mm)	0.591 (15.000mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54112-107041100LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,267	-	RFQ	Технические	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.297 (7.544mm)	0.433 (11.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-119041300LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,141	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.882 (22.400mm)	0.250 (6.350mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59112-T36-02-115LF CONN HDR 4POS 0.079 STACK T/H Amphenol ICC (FCI)	2,903	-	RFQ	Технические	Bag	Minitek® 2.00mm	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.673 (17.100mm)	0.122 (3.100mm)	0.453 (11.500mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
54111-103040850LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,093	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.196 (4.978mm)	0.335 (8.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54111-803040850LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,753	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.197 (5.000mm)	0.335 (8.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-407051300LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	2,489	-	RFQ	Технические	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.193 (4.902mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-112031300LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2,185	-	RFQ	Технические	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	1.325 (33.660mm)	0.693 (17.600mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)