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RFI и EMI - контакты, фингерсток и прокладки
| Фото: | Мфр. Часть # | Доступность | Цена | Количество | Технические | Packaging | Series | ProductStatus | Type | Shape | Width | Length | Height | Material | Plating | Plating-Thickness | AttachmentMethod |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
11-32AF-NI-160.11 X 0.32 NI 16--11-32AF-NI-16 Leader Tech Inc. |
3,213 | - |
RFQ |
Технические |
Bulk | - | Active | Fingerstock | - | 0.320 (8.13mm) | 16.000 (406.40mm) | 0.110 (2.79mm) | Beryllium Copper | Nickel | Flash | Adhesive |
|
|
11-32AH-NI-160.11 X 0.32 NI 16--11-32AH-NI-16 Leader Tech Inc. |
2,597 | - |
RFQ |
Технические |
Bulk | - | Active | Fingerstock | - | 0.320 (8.13mm) | 16.000 (406.40mm) | 0.110 (2.79mm) | Beryllium Copper | Nickel | Flash | Adhesive |
|
|
11-32AH-SN-160.11 X 0.32 SN 16--11-32AH-SN-16 Leader Tech Inc. |
3,345 | - |
RFQ |
Технические |
Bulk | - | Active | Fingerstock | - | 0.320 (8.13mm) | 16.000 (406.40mm) | 0.110 (2.79mm) | Beryllium Copper | Tin | Flash | Adhesive |
|
|
11-32RH-NI-160.11 X 0.32 NI 16--11-32RH-NI-16 Leader Tech Inc. |
2,936 | - |
RFQ |
Технические |
Bulk | - | Active | Fingerstock | - | 0.320 (8.13mm) | 16.000 (406.40mm) | 0.110 (2.79mm) | Beryllium Copper | Nickel | Flash | Adhesive |
|
|
4695PA51H00100GK NICU PTAFG PU V0 SQ Laird Technologies EMI |
2,644 | - |
RFQ |
Технические |
Bulk | 51H | Active | Fabric Over Foam | Square | 0.374 (9.50mm) | 1.000 (25.40mm) | 0.374 (9.50mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive |
|
67BCG2504303510R00SP,CON,C,AU,TNR Laird Technologies EMI |
2,411 | - |
RFQ |
Bulk | BCG | Active | Fingerstock | - | 0.098 (2.50mm) | 0.169 (4.30mm) | 0.138 (3.50mm) | Beryllium Copper | Gold | - | Solder | |
|
|
4795PA51H00100GK,NICU,PTAFG,PU,V0,REC .250X.50 Laird Technologies EMI |
2,122 | - |
RFQ |
Bulk | 51H | Active | Fabric Over Foam | Rectangle | 0.500 (12.70mm) | 1.000 (25.40mm) | 0.250 (6.35mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | |
|
|
4157PA51H00100GK,NICU,PTAFG,PU,V0,REC .060X.28 Laird Technologies EMI |
3,378 | - |
RFQ |
Bulk | ECOGREEN™ | Active | Fabric Over Foam | Rectangle | 0.787 (20.00mm) | 1.000 (25.40mm) | 0.630 (16.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | |
|
|
67BCG2003201508R00SP,CON,C,AU,TNR Laird Technologies EMI |
2,525 | - |
RFQ |
Технические |
Bulk | BCG | Active | Fingerstock | - | 0.078 (2.00mm) | 0.126 (3.20mm) | 0.059 (1.50mm) | Beryllium Copper | Gold | - | Solder |
|
|
67BCG2003002508R00SP,CON,C,AU,TNR Laird Technologies EMI |
2,489 | - |
RFQ |
Bulk | BCG | Active | - | - | - | - | - | - | - | - | - | |
|
331256381840WE-SECF SMT EMI CONTACT FINGER Würth Elektronik |
2,870 | - |
RFQ |
Tape & Reel (TR),Cut Tape (CT) | WE-SECF | Active | Shield Finger, Pre-Loaded | - | 0.098 (2.50mm) | 0.148 (3.75mm) | 0.157 (4.00mm) | Phosphor Bronze | Nickel, Tin | - | Solder | |
|
67SLH060080070PI00METAL FILM OVER FOAM CONTACTS Laird Technologies EMI |
2,883 | - |
RFQ |
Технические |
Tape & Reel (TR),Cut Tape (CT) | SMD Grounding Metallized | Active | Film Over Foam | Hourglass | 0.236 (6.00mm) | 0.276 (7.00mm) | 0.315 (8.00mm) | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | - | - | Solder |
|
|
4788PB51H00100GK,NICU,PTAFG,PU,V0,REC .125X.25 Laird Technologies EMI |
3,806 | - |
RFQ |
Технические |
Bulk | ECOGREEN™ | Active | Fabric Over Foam | Rectangle | 0.250 (6.35mm) | 1.000 (25.40mm) | 0.125 (3.18mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive |
|
|
4789PA51H00100GK NICU PTAFG PU V0 DSH Laird Technologies EMI |
2,383 | - |
RFQ |
Технические |
Bulk | 51H | Active | Fabric Over Foam | D-Shape | 0.374 (9.50mm) | 1.000 (25.40mm) | 0.252 (6.40mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive |
|
|
67BCG2003203508R00SP,CON,C,AU,TNR 3.5X2X3.2MM Laird Technologies EMI |
2,494 | - |
RFQ |
Технические |
Tape & Reel (TR) | BCG | Active | Shield Finger | - | 0.079 (2.00mm) | 0.126 (3.20mm) | 0.138 (3.50mm) | Beryllium Copper | Nickel, Tin | - | - |
|
|
67BCG2004002008R00SP,CON,C,AU,TNR Laird Technologies EMI |
3,323 | - |
RFQ |
Bulk | BCG | Active | - | - | - | - | - | - | - | - | - | |
|
|
67BCG2003004010R00SP,CON,C,AU,TNR Laird Technologies EMI |
3,132 | - |
RFQ |
Технические |
Bulk | BCG | Active | - | - | - | - | - | - | - | - | - |
|
67B5G2504004108R00SP,CON,5,AU,TNR Laird Technologies EMI |
3,692 | - |
RFQ |
Bulk | B5G | Active | Fingerstock | - | 0.098 (2.50mm) | 0.157 (4.00mm) | 0.161 (4.10mm) | Beryllium Copper | Gold | - | Solder | |
|
|
4084AA51K00100GK NICU NRS PU V0 SQ Laird Technologies EMI |
3,064 | - |
RFQ |
Технические |
Bulk | 51K | Active | Fabric Over Foam | Square | 0.500 (12.70mm) | 1.000 (25.40mm) | 0.500 (12.70mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - |
|
|
4181PA51H00200GK NICU PTAFG PU V0 DSH Laird Technologies EMI |
2,244 | - |
RFQ |
Технические |
Bulk | 51H | Active | Fabric Over Foam | D-Shape | 0.394 (10.00mm) | 2.000 (50.80mm) | 0.079 (2.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive |
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