Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
4832-6000-CP

4832-6000-CP

CONN IC DIP SOCKET 32POS TIN

3M
3,217 -

RFQ

4832-6000-CP

Технические

Tube 4800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
210-43-308-41-001000

210-43-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
2,501 -

RFQ

210-43-308-41-001000

Технические

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 16-HZL/01-TT

AR 16-HZL/01-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components
12,767 -

RFQ

AR 16-HZL/01-TT

Технические

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
1-2199300-2

1-2199300-2

CONN IC DIP SOCKET 32POS TINLEAD

TE Connectivity AMP Connectors
8,291 -

RFQ

1-2199300-2

Технические

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin-Lead 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin-Lead 60.0µin (1.52µm) Brass, Copper Polyester
4828-6004-CP

4828-6004-CP

CONN IC DIP SOCKET 28POS TIN

3M
2,442 -

RFQ

4828-6004-CP

Технические

Tube 4800 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
AR 18-HZL-TT

AR 18-HZL-TT

CONN IC DIP SOCKET 18POS TIN

Assmann WSW Components
1,470 -

RFQ

AR 18-HZL-TT

Технические

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
110-44-624-41-001000

110-44-624-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.
5,322 -

RFQ

110-44-624-41-001000

Технические

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
A-CCS 028-Z-T

A-CCS 028-Z-T

CONN SOCKET PLCC 28POS TIN

Assmann WSW Components
1,663 -

RFQ

A-CCS 028-Z-T

Технические

Tube - Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT)
110-87-422-41-001101

110-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,745 -

RFQ

110-87-422-41-001101

Технические

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 28-HZL-TT

AR 28-HZL-TT

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components
7,115 -

RFQ

AR 28-HZL-TT

Технические

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
110-43-306-41-001000

110-43-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
1,976 -

RFQ

110-43-306-41-001000

Технические

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-316-41-001000

110-44-316-41-001000

CONN IC DIP SOCKET 16POS TIN

Mill-Max Manufacturing Corp.
2,085 -

RFQ

110-44-316-41-001000

Технические

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4840-6000-CP

4840-6000-CP

CONN IC DIP SOCKET 40POS TIN

3M
6,748 -

RFQ

4840-6000-CP

Технические

Tube 4800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
05-0513-10T

05-0513-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,258 -

RFQ

05-0513-10T

Технические

Bulk 0513 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
A-CCS 020-Z-SM

A-CCS 020-Z-SM

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components
2,359 -

RFQ

A-CCS 020-Z-SM

Технические

Tube - Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled
210-1-14-003

210-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech
107 -

RFQ

210-1-14-003

Технические

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
110-87-318-41-001101

110-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,627 -

RFQ

110-87-318-41-001101

Технические

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
1-2199299-5

1-2199299-5

40P,DIP SKT,600 CL,LDR,PB FREE

TE Connectivity AMP Connectors
7,006 -

RFQ

1-2199299-5

Технические

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Nickel Polybutylene Terephthalate (PBT), Glass Filled
808-AG11D-ES

808-AG11D-ES

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
1,527 -

RFQ

808-AG11D-ES

Технические

Tube 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
A-CCS 044-Z-SM

A-CCS 044-Z-SM

IC SOCKET PLCC 44POS TIN SMD

Assmann WSW Components
18,307 -

RFQ

A-CCS 044-Z-SM

Технические

Tube - Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled
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