Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
PLCC-20-AT

PLCC-20-AT

PLCC 20P THROUGH HOLE

Adam Tech
637 -

RFQ

PLCC-20-AT

Технические

Tube PLCC Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICM-628-1-GT-HT

ICM-628-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 28P

Adam Tech
240 -

RFQ

ICM-628-1-GT-HT

Технические

Tube ICM Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
PLCC-32-AT

PLCC-32-AT

PLCC 32P THROUGH HOLE

Adam Tech
3,665 -

RFQ

PLCC-32-AT

Технические

Tube PLCC Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICM-328-1-GT-HT

ICM-328-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 28P

Adam Tech
2,946 -

RFQ

ICM-328-1-GT-HT

Технические

Tube ICM Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
PLCC-68-AT-SMT

PLCC-68-AT-SMT

CONN SOCKET PLCC 68POS PHOS BRNZ

Adam Tech
323 -

RFQ

PLCC-68-AT-SMT

Технические

Tube PLCC Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICM-632-1-GT-HT

ICM-632-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 32P

Adam Tech
365 -

RFQ

ICM-632-1-GT-HT

Технические

Tube ICM Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
PLCC-84-AT

PLCC-84-AT

PLCC 84P THROUGH HOLE

Adam Tech
116 -

RFQ

PLCC-84-AT

Технические

Tube PLCC Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICM-640-1-GT-HT

ICM-640-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 40P

Adam Tech
479 -

RFQ

ICM-640-1-GT-HT

Технические

Tube ICM Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
ICM-648-1-GT-HT

ICM-648-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 48P

Adam Tech
851 -

RFQ

ICM-648-1-GT-HT

Технические

Tube ICM Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
PLCC-52-AT

PLCC-52-AT

PLCC 52P THROUGH HOLE

Adam Tech
275 -

RFQ

PLCC-52-AT

Технические

Tube PLCC Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
PLCC-68-AT

PLCC-68-AT

PLCC 68P THROUGH HOLE

Adam Tech
1,216 -

RFQ

PLCC-68-AT

Технические

Tube PLCC Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICM-324-1-GT-HT

ICM-324-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 24P

Adam Tech
190 -

RFQ

ICM-324-1-GT-HT

Технические

Tube ICM Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
PLCC-84-AT-SMT

PLCC-84-AT-SMT

PLCC SOCKET 84P SMT

Adam Tech
448 -

RFQ

PLCC-84-AT-SMT

Технические

Tube PLCC Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICS-316-T

ICS-316-T

IC SOCKET, DIP, 16P 2.54MM PITCH

Adam Tech
3,843 -

RFQ

ICS-316-T

Технические

Tube ICS Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICS-624-T

ICS-624-T

IC SOCKET, DIP, 24P 2.54MM PITCH

Adam Tech
2,879 -

RFQ

ICS-624-T

Технические

Tube ICS Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICM-314-1-GT-HT

ICM-314-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 14P

Adam Tech
2,863 -

RFQ

ICM-314-1-GT-HT

Технические

Tube ICM Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
ICM-316-1-GT-HT

ICM-316-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 16P

Adam Tech
3,843 -

RFQ

ICM-316-1-GT-HT

Технические

Tube ICM Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
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