Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-87-310-41-105191

110-87-310-41-105191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,762 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-314-41-134191

114-87-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,094 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-001101

116-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,187 -

RFQ

116-87-308-41-001101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-310-41-001101

612-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,650 -

RFQ

612-83-310-41-001101

Технические

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-610-41-001101

612-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,691 -

RFQ

612-83-610-41-001101

Технические

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-318-41-117101

114-87-318-41-117101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,505 -

RFQ

114-87-318-41-117101

Технические

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-032-17-400-TR

540-88-032-17-400-TR

CONN SOCKET PLCC 32POS TIN

Preci-Dip
2,453 -

RFQ

540-88-032-17-400-TR

Технические

Tape & Reel (TR) 540 Active PLCC 32 (4 x 8) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
612-87-314-41-001101

612-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,749 -

RFQ

612-87-314-41-001101

Технические

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-10-002101

110-83-314-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,386 -

RFQ

110-83-314-10-002101

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-003101

116-87-312-41-003101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,684 -

RFQ

116-87-312-41-003101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-105161

110-87-314-41-105161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,262 -

RFQ

110-87-314-41-105161

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-006101

116-87-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,258 -

RFQ

116-87-314-41-006101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-012101

116-83-308-41-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,503 -

RFQ

116-83-308-41-012101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-308-41-001101

121-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,744 -

RFQ

121-83-308-41-001101

Технические

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-105161

110-83-310-41-105161

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,208 -

RFQ

110-83-310-41-105161

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-308-41-001101

122-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,807 -

RFQ

122-83-308-41-001101

Технические

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-308-41-001101

123-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,412 -

RFQ

123-83-308-41-001101

Технические

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-322-41-005101

110-87-322-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,638 -

RFQ

110-87-322-41-005101

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-422-41-005101

110-87-422-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,954 -

RFQ

110-87-422-41-005101

Технические

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-422-41-605101

110-87-422-41-605101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,856 -

RFQ

110-87-422-41-605101

Технические

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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