Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-87-312-41-036101

146-87-312-41-036101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,501 -

RFQ

146-87-312-41-036101

Технические

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-324-41-117101

114-87-324-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,004 -

RFQ

114-87-324-41-117101

Технические

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-324-41-134161

114-87-324-41-134161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,517 -

RFQ

114-87-324-41-134161

Технические

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-424-41-117101

114-87-424-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,573 -

RFQ

114-87-424-41-117101

Технические

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-008101

116-87-312-41-008101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,314 -

RFQ

116-87-312-41-008101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-314-41-134191

114-83-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,850 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-105161

110-87-318-41-105161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,309 -

RFQ

110-87-318-41-105161

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-006101

116-87-318-41-006101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,995 -

RFQ

116-87-318-41-006101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-007101

116-83-310-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,047 -

RFQ

116-83-310-41-007101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-007101

116-83-610-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,252 -

RFQ

116-83-610-41-007101

Технические

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-314-41-001101

612-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,884 -

RFQ

612-83-314-41-001101

Технические

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-318-41-001101

115-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,506 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-324-41-003101

115-87-324-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,880 -

RFQ

115-87-324-41-003101

Технические

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-424-41-003101

115-87-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,880 -

RFQ

115-87-424-41-003101

Технические

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-037-10-061101

510-87-037-10-061101

CONN SOCKET PGA 37POS GOLD

Preci-Dip
3,759 -

RFQ

510-87-037-10-061101

Технические

Bulk 510 Active PGA 37 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-005101

110-83-318-41-005101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,717 -

RFQ

110-83-318-41-005101

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-605101

110-83-318-41-605101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,448 -

RFQ

110-83-318-41-605101

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-001101

110-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,092 -

RFQ

110-83-320-41-001101

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-001151

110-83-320-41-001151

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,116 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-420-41-001101

110-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,302 -

RFQ

110-83-420-41-001101

Технические

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
В целом 2821 Запись«Предыдущий1... 2122232425262728...142Следующий»
1500+
1500+ Ежедневный
20,000.000
20,000.000 Продукты
1800+
1800+ производители
15,000+
15,000+ Складские запасы
Нахождение Чипа

Главная

Нахождение Чипа

Продукт

Нахождение Чипа

Телефон

Нахождение Чипа

Пользователь