Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-632-41-011101

116-83-632-41-011101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,160 -

RFQ

116-83-632-41-011101

Технические

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-095-14-091101

510-83-095-14-091101

CONN SOCKET PGA 95POS GOLD

Preci-Dip
3,668 -

RFQ

510-83-095-14-091101

Технические

Bulk 510 Active PGA 95 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-308-G-A1

APA-308-G-A1

ADAPTER PLUG

Samtec Inc.
3,862 -

RFQ

Bulk APA Active - 8 (2 x 4) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-87-322-41-013101

116-87-322-41-013101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,306 -

RFQ

116-87-322-41-013101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-013101

116-87-422-41-013101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,943 -

RFQ

116-87-422-41-013101

Технические

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-93-328-31-012000

614-93-328-31-012000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,797 -

RFQ

614-93-328-31-012000

Технические

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-636-41-009101

116-83-636-41-009101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,158 -

RFQ

116-83-636-41-009101

Технические

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-161-14-051101

510-87-161-14-051101

CONN SOCKET PGA 161POS GOLD

Preci-Dip
2,396 -

RFQ

510-87-161-14-051101

Технические

Bulk 510 Active PGA 161 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-640-41-035101

146-83-640-41-035101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,508 -

RFQ

146-83-640-41-035101

Технические

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-640-41-036101

146-83-640-41-036101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,350 -

RFQ

146-83-640-41-036101

Технические

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
940-44-052-17-400004

940-44-052-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.
3,228 -

RFQ

940-44-052-17-400004

Технические

Tape & Reel (TR) 940 Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS)
116-83-320-41-013101

116-83-320-41-013101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,089 -

RFQ

116-83-320-41-013101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-013101

116-83-420-41-013101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,763 -

RFQ

116-83-420-41-013101

Технические

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-096-14-091101

510-83-096-14-091101

CONN SOCKET PGA 96POS GOLD

Preci-Dip
3,548 -

RFQ

510-83-096-14-091101

Технические

Bulk 510 Active PGA 96 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-93-424-41-001000

123-93-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,451 -

RFQ

123-93-424-41-001000

Технические

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-624-41-001000

123-43-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,609 -

RFQ

123-43-624-41-001000

Технические

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-642-41-001101

116-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,693 -

RFQ

116-87-642-41-001101

Технические

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-153-15-061101

510-87-153-15-061101

CONN SOCKET PGA 153POS GOLD

Preci-Dip
2,636 -

RFQ

510-87-153-15-061101

Технические

Bulk 510 Active PGA 153 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-3518-11

24-3518-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,103 -

RFQ

24-3518-11

Технические

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-87-764-41-105101

117-87-764-41-105101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,607 -

RFQ

117-87-764-41-105101

Технические

Bulk 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
1500+
1500+ Ежедневный
20,000.000
20,000.000 Продукты
1800+
1800+ производители
15,000+
15,000+ Складские запасы
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