Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
33-0518-00

33-0518-00

CONN SOCKET SIP 33POS GOLD

Aries Electronics
2,862 -

RFQ

33-0518-00

Технические

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
546-87-085-11-002135

546-87-085-11-002135

CONN SOCKET PGA 85POS GOLD

Preci-Dip
2,487 -

RFQ

546-87-085-11-002135

Технические

Bulk 546 Active PGA 85 (11 x 11) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-085-11-002136

546-87-085-11-002136

CONN SOCKET PGA 85POS GOLD

Preci-Dip
3,852 -

RFQ

546-87-085-11-002136

Технические

Bulk 546 Active PGA 85 (11 x 11) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-304-31-002000

614-41-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,797 -

RFQ

614-41-304-31-002000

Технические

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-304-31-002000

614-91-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,428 -

RFQ

614-91-304-31-002000

Технические

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
528-AG11D

528-AG11D

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
3,752 -

RFQ

528-AG11D

Технические

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
614-93-304-31-012000

614-93-304-31-012000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.
3,749 -

RFQ

614-93-304-31-012000

Технические

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-304-31-012000

614-43-304-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,460 -

RFQ

614-43-304-31-012000

Технические

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-3518-111

28-3518-111

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,056 -

RFQ

28-3518-111

Технические

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-111

28-6518-111

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,898 -

RFQ

28-6518-111

Технические

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0517-90C

19-0517-90C

CONN SOCKET SIP 19POS GOLD

Aries Electronics
2,320 -

RFQ

19-0517-90C

Технические

Bulk 0517 Active SIP 19 (1 x 19) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-130-31-018000

714-43-130-31-018000

CONN SOCKET SIP 30POS GOLD

Mill-Max Manufacturing Corp.
3,909 -

RFQ

714-43-130-31-018000

Технические

Bulk 714 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-314-G-A1

APA-314-G-A1

ADAPTER PLUG

Samtec Inc.
2,586 -

RFQ

Bulk APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-83-156-15-061101

510-83-156-15-061101

CONN SOCKET PGA 156POS GOLD

Preci-Dip
3,200 -

RFQ

510-83-156-15-061101

Технические

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-156-15-062101

510-83-156-15-062101

CONN SOCKET PGA 156POS GOLD

Preci-Dip
2,244 -

RFQ

510-83-156-15-062101

Технические

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-156-16-001101

510-83-156-16-001101

CONN SOCKET PGA 156POS GOLD

Preci-Dip
3,619 -

RFQ

510-83-156-16-001101

Технические

Bulk 510 Active PGA 156 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-156-16-091101

510-83-156-16-091101

CONN SOCKET PGA 156POS GOLD

Preci-Dip
3,365 -

RFQ

510-83-156-16-091101

Технические

Bulk 510 Active PGA 156 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-93-304-31-018000

614-93-304-31-018000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.
3,967 -

RFQ

614-93-304-31-018000

Технические

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-304-31-018000

614-43-304-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,742 -

RFQ

614-43-304-31-018000

Технические

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3513-10H

24-3513-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,807 -

RFQ

24-3513-10H

Технические

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1500+
1500+ Ежедневный
20,000.000
20,000.000 Продукты
1800+
1800+ производители
15,000+
15,000+ Складские запасы
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