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| Фото: | Мфр. Часть # | Доступность | Цена | Количество | Технические | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
12-8450-310CCONN IC DIP SOCKET 12POS GOLD Aries Electronics |
3,256 | - |
RFQ |
Технические |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-8510-310CCONN IC DIP SOCKET 12POS GOLD Aries Electronics |
3,965 | - |
RFQ |
Технические |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-8590-310CCONN IC DIP SOCKET 12POS GOLD Aries Electronics |
2,055 | - |
RFQ |
Технические |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
23-0517-90CCONN SOCKET SIP 23POS GOLD Aries Electronics |
2,381 | - |
RFQ |
Технические |
Bulk | 0517 | Active | SIP | 23 (1 x 23) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
39-0511-10CONN SOCKET SIP 39POS TIN Aries Electronics |
3,742 | - |
RFQ |
Технические |
Bulk | 511 | Active | SIP | 39 (1 x 39) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-820-90TWRCONN IC DIP SOCKET 16POS TIN Aries Electronics |
3,565 | - |
RFQ |
Технические |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
16-822-90TWRCONN IC DIP SOCKET 16POS TIN Aries Electronics |
2,599 | - |
RFQ |
Технические |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
16-823-90TWRCONN IC DIP SOCKET 16POS TIN Aries Electronics |
2,300 | - |
RFQ |
Технические |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
18-6503-20CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,702 | - |
RFQ |
Технические |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-6503-30CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,609 | - |
RFQ |
Технические |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
614-87-088-13-062112CONN SOCKET PGA 88POS GOLD Preci-Dip |
2,940 | - |
RFQ |
Технические |
Bulk | 614 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-088-13-081112CONN SOCKET PGA 88POS GOLD Preci-Dip |
3,872 | - |
RFQ |
Технические |
Bulk | 614 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-309-21-001101CONN SOCKET PGA 309POS GOLD Preci-Dip |
2,542 | - |
RFQ |
Технические |
Bulk | 510 | Active | PGA | 309 (21 x 21) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-201-15-041101CONN SOCKET PGA 201POS GOLD Preci-Dip |
3,093 | - |
RFQ |
Технические |
Bulk | 510 | Active | PGA | 201 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
40-0518-00CONN SOCKET SIP 40POS GOLD Aries Electronics |
3,839 | - |
RFQ |
Технические |
Bulk | 518 | Active | SIP | 40 (1 x 40) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-1518-00CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
3,915 | - |
RFQ |
Технические |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
35-0518-11HCONN SOCKET SIP 35POS GOLD Aries Electronics |
2,059 | - |
RFQ |
Технические |
Bulk | 518 | Active | SIP | 35 (1 x 35) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-0518-11HCONN SOCKET SIP 40POS GOLD Aries Electronics |
2,549 | - |
RFQ |
Технические |
Bulk | 518 | Active | SIP | 40 (1 x 40) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-314-G-NADAPTER PLUG Samtec Inc. |
2,568 | - |
RFQ |
Tube | APA | Active | - | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
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|
346-93-154-41-013000CONN SOCKET SIP 54POS GOLD Mill-Max Manufacturing Corp. |
3,191 | - |
RFQ |
Технические |
Bulk | 346 | Active | SIP | 54 (1 x 54) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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