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Разъемы для ИС, Транзисторов
| Фото: | Мфр. Часть # | Доступность | Цена | Количество | Технические | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-13-281-19-081003CONN RECEPT PIN Mill-Max Manufacturing Corp. |
2,166 | - |
RFQ |
Tube | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-13-281-19-081001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,874 | - |
RFQ |
Технические |
Bulk | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-281-19-081002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,872 | - |
RFQ |
Технические |
Bulk | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
550-10-560M33-001152BGA SOLDER TAIL Preci-Dip |
2,737 | - |
RFQ |
Технические |
Bulk | 550 | Active | BGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-500M30-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,072 | - |
RFQ |
Технические |
Bulk | 558 | Active | BGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-500M30-001105CONN SOCKET PGA 500POS GOLD Preci-Dip |
3,147 | - |
RFQ |
Технические |
Bulk | 518 | Active | PGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-504M29-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,520 | - |
RFQ |
Технические |
Bulk | 558 | Active | BGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
510-13-289-17-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,157 | - |
RFQ |
Технические |
Bulk | 510 | Active | PGA | 289 (17 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-289-17-000002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,225 | - |
RFQ |
Технические |
Bulk | 510 | Active | PGA | 289 (17 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-289-17-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,657 | - |
RFQ |
Технические |
Bulk | 510 | Active | PGA | 289 (17 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
518-77-504M29-001105CONN SOCKET PGA 504POS GOLD Preci-Dip |
3,608 | - |
RFQ |
Технические |
Bulk | 518 | Active | PGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
20-PLS13120-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,069 | - |
RFQ |
Технические |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
20-PRS13120-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,522 | - |
RFQ |
Технические |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
36-3551-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
3,401 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-3553-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
3,439 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-6551-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
2,993 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-6552-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
2,648 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-6553-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
2,259 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled |
|
|
36-3552-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
3,352 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-3554-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
3,982 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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