Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-87-318-41-001101

612-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,414 -

RFQ

612-87-318-41-001101

Технические

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-012101

116-87-314-41-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,407 -

RFQ

116-87-314-41-012101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-001101

116-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,792 -

RFQ

116-87-310-41-001101

Технические

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-001101

116-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,741 -

RFQ

116-87-210-41-001101

Технические

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-001101

116-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,328 -

RFQ

116-87-610-41-001101

Технические

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-306-10-001101

299-87-306-10-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,415 -

RFQ

299-87-306-10-001101

Технические

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-002101

116-87-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,094 -

RFQ

116-87-312-41-002101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-003101

116-83-312-41-003101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,223 -

RFQ

116-83-312-41-003101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-312-41-035101

146-87-312-41-035101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,834 -

RFQ

146-87-312-41-035101

Технические

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-312-41-036101

146-87-312-41-036101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,501 -

RFQ

146-87-312-41-036101

Технические

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-324-41-117101

114-87-324-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,004 -

RFQ

114-87-324-41-117101

Технические

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-324-41-134161

114-87-324-41-134161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,517 -

RFQ

114-87-324-41-134161

Технические

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-424-41-117101

114-87-424-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,573 -

RFQ

114-87-424-41-117101

Технические

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-008101

116-87-312-41-008101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,314 -

RFQ

116-87-312-41-008101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-314-41-134191

114-83-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,850 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-105161

110-87-318-41-105161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,309 -

RFQ

110-87-318-41-105161

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-006101

116-87-318-41-006101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,995 -

RFQ

116-87-318-41-006101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-007101

116-83-310-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,047 -

RFQ

116-83-310-41-007101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-007101

116-83-610-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,252 -

RFQ

116-83-610-41-007101

Технические

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SMPX-28LCC-N

SMPX-28LCC-N

SMT PLCC SOCKET 28P NON POLARISE

Kycon, Inc.
2,118 -

RFQ

SMPX-28LCC-N

Технические

Tube SMPX Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
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