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Тепловое - Радиаторы
| Фото: | Мфр. Часть # | Доступность | Цена | Количество | Технические | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSS-B20-097HHEATSINK TO-220 3.6W ALUMINUM CUI Devices |
3,368 | - |
RFQ |
Технические |
Bag | HSS | Active | Board Level, Vertical | PC Pin | Rectangular, Fins | 0.394 (10.00mm) | 0.830 (21.08mm) | - | 0.748 (19.00mm) | 3.6W @ 75°C | 5.39°C/W @ 200 LFM | 20.59°C/W | Aluminum | |
|
HSS-B20-0953HHEATSINK TO-220 4W ALUMINUM CUI Devices |
2,633 | - |
RFQ |
Технические |
Box | HSS | Active | Board Level | PC Pin | Rectangular, Fins | 1.500 (38.10mm) | 0.504 (12.80mm) | - | 0.500 (12.70mm) | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | Aluminum | |
|
HSB04-171706HEAT SINK, BGA, 17 X 17 X 6 MM CUI Devices |
3,060 | - |
RFQ |
Технические |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 0.669 (17.00mm) | 0.669 (17.00mm) | - | 0.236 (6.00mm) | 2.5W @ 75°C | 13.10°C/W @ 200 LFM | 29.73°C/W | Aluminum Alloy | |
|
HSE-B20250-040HHEAT SINK, EXTRUSION, TO-220, 25 CUI Devices |
3,402 | - |
RFQ |
Технические |
Tray | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 0.984 (25.00mm) | 1.378 (35.00mm) | - | 0.492 (12.50mm) | 5.0W @ 75°C | 4.28°C/W @ 200 LFM | 15.00°C/W | Aluminum Alloy | |
|
578105B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
3,832 | - |
RFQ |
Технические |
Bulk | - | Active | Top Mount | Press Fit | Rectangular, Fins | 0.406 (10.31mm) | 0.830 (21.08mm) | 0.316 (8.03mm) ID | 0.395 (10.03mm) | 1.0W @ 40°C | 35.00°C/W @ 200 LFM | 40.00°C/W | Aluminum | |
|
HSB07-202009HEAT SINK, BGA, 20 X 20 X 9 MM CUI Devices |
2,952 | - |
RFQ |
Технические |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 0.787 (20.00mm) | 0.787 (20.00mm) | - | 0.354 (9.00mm) | 3.1W @ 75°C | 8.60°C/W @ 200 LFM | 24.08°C/W | Aluminum Alloy | |
|
231-69PABE-15VHEATSINK TO-220 VERT BLK Wakefield-Vette |
3,262 | - |
RFQ |
Box | 231 | Active | Board Level, Vertical | Bolt On and Board Mounts | Rectangular, Fins | 0.690 (17.53mm) | 0.835 (21.21mm) | - | 0.400 (10.16mm) | 2.0W @ 45°C | 8.00°C/W @ 400 LFM | - | Aluminum | ||
|
|
218-40CTE3HEATSINK ALUM BLACK SMD Wakefield-Vette |
3,457 | - |
RFQ |
Технические |
Bulk | 218 | Active | Top Mount | SMD Pad | Rectangular, Fins | 0.320 (8.13mm) | 0.900 (22.86mm) | - | 0.400 (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Copper | |
|
HSS-C52-NP-SMT-TRHEAT SINK TO-252 COPPER CUI Devices |
3,499 | - |
RFQ |
Технические |
Tape & Reel (TR) | HSS | Active | Top Mount | - | Rectangular, Fins | 0.315 (8.00mm) | 0.900 (22.86mm) | - | 0.400 (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Copper | |
|
V7477YCHEATSINK ALUM ANOD Assmann WSW Components |
3,121 | - |
RFQ |
Технические |
Tray | - | Active | Top Mount | Bolt On and PC Pin | Square, Pin Fins | 2.000 (50.80mm) | 1.374 (34.90mm) | - | 0.500 (12.70mm) | - | - | 9.00°C/W | Aluminum | |
|
|
V2203BFINGER-SHAPED-HEATSINK 8K/W Assmann WSW Components |
3,111 | - |
RFQ |
Технические |
Bulk | - | Active | Board Level | Thermal Tape, Adhesive (Not Included) | Square, Fins | 1.457 (37.00mm) | 1.457 (37.00mm) | - | 0.551 (14.00mm) | - | - | - | Aluminum Alloy | |
|
XL25-30-30-5CERAMIC HEAT SPREADER 30X30MM GR t-Global Technology |
2,649 | - |
RFQ |
Технические |
Tray | XL-25 | Obsolete | Heat Spreader | - | Square | 1.181 (30.00mm) | 1.181 (30.00mm) | - | 0.197 (5.00mm) | - | - | - | Ceramic | |
|
V7477Y2HEATSINK ALUM ANOD Assmann WSW Components |
2,192 | - |
RFQ |
Технические |
Tray | - | Active | Top Mount | PC Pin | Square, Pin Fins | 1.209 (30.70mm) | 1.209 (30.70mm) | - | 0.500 (12.70mm) | - | - | 9.00°C/W | Aluminum | |
|
HSE-B20254-035H-02HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices |
3,625 | - |
RFQ |
Технические |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 1.000 (25.40mm) | 1.378 (35.00mm) | - | 0.500 (12.70mm) | 5.5W @ 75°C | 4.39°C/W @ 200 LFM | 13.64°C/W | Aluminum Alloy | |
|
|
218-40CTE5HEATSINK ALUM NATURAL SMD Wakefield-Vette |
3,551 | - |
RFQ |
Технические |
Bulk | 218 | Active | Top Mount | SMD Pad | Rectangular, Fins | 0.500 (12.70mm) | 1.030 (26.16mm) | - | 0.400 (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Copper | |
|
|
560200B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,877 | - |
RFQ |
Технические |
Bulk | - | Active | Top Mount | Press Fit, Slide On | Rectangular, Fins | 0.890 (22.61mm) | 0.600 (15.24mm) | - | 0.410 (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Aluminum | |
|
|
HSE-B20270-040HHEAT SINK, EXTRUSION, TO-220, 27 CUI Devices |
3,734 | - |
RFQ |
Технические |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 1.063 (27.00mm) | 1.378 (35.00mm) | - | 0.492 (12.50mm) | 6.0W @ 75°C | 3.64°C/W @ 200 LFM | 12.50°C/W | Aluminum Alloy | |
|
|
XL25-40-40-5CERAMIC HEAT SPREADER 40X40MM GR t-Global Technology |
2,695 | - |
RFQ |
Технические |
Tray | XL-25 | Obsolete | Heat Spreader | - | Square | 1.575 (40.00mm) | 1.575 (40.00mm) | - | 0.197 (5.00mm) | - | - | - | Ceramic | |
|
|
579604B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,041 | - |
RFQ |
Технические |
Bulk | - | Active | Board Level | Clip | Rectangular, Fins | 0.900 (22.86mm) | 0.745 (18.92mm) | - | 0.420 (10.67mm) | 1.5W @ 40°C | 6.00°C/W @ 700 LFM | 24.00°C/W | Aluminum | |
|
|
V6534E1-THEATSINK ALUM ANOD Assmann WSW Components |
3,000 | - |
RFQ |
Технические |
Bulk | - | Active | Board Level, Vertical | PC Pin | Rectangular, Fins | 0.393 (10.00mm) | 0.984 (25.00mm) | - | 0.894 (22.71mm) | - | - | 35.20°C/W | Aluminum |
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