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Тепловое - Радиаторы
| Фото: | Мфр. Часть # | Доступность | Цена | Количество | Технические | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSE-B508-045HHEAT SINK, EXTRUSION, TO-220, 50 CUI Devices |
2,954 | - |
RFQ |
Технические |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 2.000 (50.80mm) | 1.772 (45.00mm) | - | 0.500 (12.70mm) | 9.3W @ 75°C | 4.38°C/W @ 200 LFM | 8.06°C/W | Aluminum Alloy | |
|
HSE-B20630-040H-01HEAT SINK, EXTRUSION, TO-220, 63 CUI Devices |
2,387 | - |
RFQ |
Технические |
Box | HSE | Active | Board Level, Vertical | PC Pin | Rectangular, Angled Fins | 2.480 (63.00mm) | 1.359 (34.50mm) | - | 0.492 (12.50mm) | 9.1W @ 75°C | 9.10°C/W @ 200 LFM | 8.24°C/W | Aluminum Alloy | |
|
690-3BHEATSINK EXTRUSION Wakefield-Vette |
3,072 | - |
RFQ |
Технические |
Bulk | 690 | Active | Board Level, Extrusion | Bolt On | Square, Fins | 1.860 (47.24mm) | 1.860 (47.24mm) | - | 1.310 (33.27mm) | 7.5W @ 44°C | 2.00°C/W @ 400 LFM | - | Aluminum | |
|
HSE-B500-04HHEAT SINK, EXTRUSION, TO-220, 50 CUI Devices |
2,197 | - |
RFQ |
Технические |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.969 (50.00mm) | 1.378 (35.00mm) | - | 1.000 (25.40mm) | 12.2W @ 75°C | 2.88°C/W @ 200 LFM | 8.05°C/W | Aluminum Alloy | |
|
624-25ABT1EHEATSINK FOR 21MM BGA Wakefield-Vette |
3,772 | - |
RFQ |
Технические |
Bulk | 624 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.250 (6.35mm) | - | 25.00°C/W @ 200 LFM | - | Aluminum | |
|
HSE-B20630-040HHEAT SINK, EXTRUSION, TO-220, 63 CUI Devices |
2,266 | - |
RFQ |
Технические |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 2.480 (63.00mm) | 1.378 (35.00mm) | - | 0.492 (12.50mm) | 9.6W @ 75°C | 3.76°C/W @ 200 LFM | 7.81°C/W | Aluminum Alloy | |
|
|
625-60ABHEATSINK FOR 25MM BGA Wakefield-Vette |
2,015 | - |
RFQ |
Технические |
Bulk | 625 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.600 (15.24mm) | - | 8.00°C/W @ 200 LFM | - | Aluminum | |
|
|
628-25ABHEATSINK FOR 45MM BGA Wakefield-Vette |
3,279 | - |
RFQ |
Технические |
Bulk | 628 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.750 (44.45mm) | 1.700 (43.18mm) | - | 0.250 (6.35mm) | 4.5W @ 80°C | 7.00°C/W @ 300 LFM | - | Aluminum | |
|
|
634-10ABHEATSINK TO-220 VERT MT BLK 1 Wakefield-Vette |
2,349 | - |
RFQ |
Технические |
Bulk | 634 | Active | Board Level, Vertical | Bolt On | Rectangular, Fins | 1.000 (25.40mm) | 0.640 (16.26mm) | - | 0.640 (16.26mm) | - | - | - | Aluminum | |
|
HSE-B18317-035H-01HEAT SINK, EXTRUSION, TO-218, 31 CUI Devices |
3,908 | - |
RFQ |
Технические |
Box | HSE | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Angled Fins | 1.250 (31.75mm) | 1.638 (41.60mm) | - | 0.984 (25.00mm) | 10.0W @ 75°C | 4.33°C/W @ 200 LFM | 7.50°C/W | Aluminum Alloy | |
|
|
HSE-B18381-035H-02HEAT SINK, EXTRUSION, TO-218, 38 CUI Devices |
2,492 | - |
RFQ |
Технические |
Box | HSE | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Angled Fins | 1.500 (38.10mm) | 1.638 (41.60mm) | - | 0.984 (25.00mm) | 12.0W @ 75°C | 3.79°C/W @ 200 LFM | 6.25°C/W | Aluminum Alloy | |
|
|
630-45ABHEATSINK FOR BGAS FIN HGT .45 Wakefield-Vette |
2,737 | - |
RFQ |
Технические |
Bulk | 630 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.450 (11.43mm) | - | 4.00°C/W @ 400 LFM | - | Aluminum | |
|
|
529801B02100GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,208 | - |
RFQ |
Технические |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.500 (38.10mm) | 1.650 (41.91mm) | - | 1.000 (25.40mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.00°C/W | Aluminum | |
|
|
634-15ABHEATSINK SLIM VERT BLACK TO-220 Wakefield-Vette |
2,830 | - |
RFQ |
Технические |
Bulk | 634 | Active | Board Level, Vertical | Bolt On | Rectangular, Fins | 1.500 (38.10mm) | 0.640 (16.26mm) | - | 0.640 (16.26mm) | 3.0W @ 50°C | 2.00°C/W @ 300 LFM | 50.00°C/W | Aluminum | |
|
CSM221-28AEHEATSINK BLACK ANODIZED Ohmite |
3,527 | - |
RFQ |
Технические |
Box | CSM | Active | Board Level, Vertical | Solderable Feet | Rectangular, Fins | 1.102 (28.00mm) | 0.492 (12.50mm) | - | 1.228 (31.20mm) | 5.0W @ 60°C | - | 12.80°C/W | Aluminum | |
|
V2200N1-F-LPHEATSINK CPU W/ADHESIVE STAMPED Assmann WSW Components |
3,142 | - |
RFQ |
Технические |
Bulk | - | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Fins | 1.181 (30.00mm) | 1.181 (30.00mm) | - | 0.512 (13.00mm) | - | - | - | Aluminum Alloy | |
|
PH3N-101.6-38.1-0.062-1APH3N NANO 101.6X38.1X0.062MM t-Global Technology |
3,727 | - |
RFQ |
Технические |
Bulk | PH3n | Obsolete | Heat Spreader | Adhesive | Rectangular | 4.000 (101.60mm) | 1.500 (38.10mm) | - | 0.002 (0.06mm) | - | - | - | Copper | |
|
|
624-35ABT1EHEATSINK FOR 21MM BGA Wakefield-Vette |
3,132 | - |
RFQ |
Технические |
Bulk | 624 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.350 (8.89mm) | - | 15.00°C/W @ 400 LFM | - | Aluminum | |
|
|
630-25ABT3HEATSINK FOR 35MM BGA Wakefield-Vette |
2,234 | - |
RFQ |
Технические |
Bulk | 630 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.250 (6.35mm) | - | 7.00°C/W @ 500 LFM | - | Aluminum | |
|
|
630-25ABT4EHEATSINK FOR 35MM BGA Wakefield-Vette |
3,775 | - |
RFQ |
Технические |
Bulk | 630 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.250 (6.35mm) | - | 7.00°C/W @ 500 LFM | - | Aluminum |
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