AMD Xilinx XCZU4EG-L1FBVB900I

Номер детали
XCZU4EG-L1FBVB900I
Производитель
AMD Xilinx
Категория:
Встроенные - система на кристалле (SoC)
Упаковка
900-BBGA, FCBGA
Технические
Нахождение ЧипаXCZU4EG-L1FBVB900I.pdf
Описание
IC SOC CORTEX-A53 900FCBGA
Количество

Модуль$0

Извлечение$0

Оплата
payment
Доставка
payment

Product details

1. How to order XCZU4EG-L1FBVB900I on Нахождение Чипа?

Currently, Нахождение Чипа only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

2. How does Нахождение Чипа guarantee that XCZU4EG-L1FBVB900I is from the original manufacturer or authorized agents?

We have a professional and experienced quality control team to strictly verify and test the XCZU4EG-L1FBVB900I. All suppliers must pass our qualification reviews before they can publish their products including XCZU4EG-L1FBVB900I on Нахождение Чипа; we pay more attention to the channels and quality of XCZU4EG-L1FBVB900I products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the XCZU4EG-L1FBVB900I price and inventory displayed accurate?

The price and inventory of XCZU4EG-L1FBVB900I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

Wire Transfer, PayPal, Alipay, Wechat, Credit Card, Western Union, MoneyGram, and Escrow are all acceptable.

Warm Tips: Some orders in certain payment forms may require handling fee.

5. How is the shipping arranged?

Customers can choose industry-leading freight companies, including DHL, UPS, FedEx, TNT, and Registered Mail. Shipping insurance is also available.

Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCZU4EG-L1FBVB900I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCZU4EG-L1FBVB900I we delivered, we will accept the replacement or return of the XCZU4EG-L1FBVB900I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCZU4EG-L1FBVB900I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as XCZU4EG-L1FBVB900I pin diagram, XCZU4EG-L1FBVB900I datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Изображение XAZU2EG-1SFVC784I XCZU4EG-1SFVC784E XCZU9EG-2FFVC900E XCZU9EG-2FFVB1156E XCZU2EG-L1SBVA484I
Номер детали XAZU2EG-1SFVC784I XCZU4EG-1SFVC784E XCZU9EG-2FFVC900E XCZU9EG-2FFVB1156E XCZU2EG-L1SBVA484I
Производитель AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Package/Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Packaging Tray Tray Tray Tray Tray
Series Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG
ProductStatus Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
FlashSize - - - - -
RAMSize 256KB 256KB 256KB 256KB 256KB
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)

XCZU4EG-L1FBVB900I Актуальная информация

Включенные следующие детали "XCZU4EG-L1FBVB900I" ISSI, Интегрированные Силиконовые Решения Инк XCZU4EG-L1FBVB900I.

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