Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-310-41-011101

116-83-310-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,838 -

RFQ

116-83-310-41-011101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-011101

116-83-610-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,815 -

RFQ

116-83-610-41-011101

Технические

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-322-41-117101

114-83-322-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,359 -

RFQ

114-83-322-41-117101

Технические

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-422-41-117101

114-83-422-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,113 -

RFQ

114-83-422-41-117101

Технические

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-324-41-105161

110-87-324-41-105161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,107 -

RFQ

110-87-324-41-105161

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-308-10-001101

299-87-308-10-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,068 -

RFQ

299-87-308-10-001101

Технические

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-009101

116-83-312-41-009101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,889 -

RFQ

116-83-312-41-009101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-318-41-001101

612-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,387 -

RFQ

612-83-318-41-001101

Технические

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-018101

116-87-422-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,271 -

RFQ

116-87-422-41-018101

Технические

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-049-07-000101

510-87-049-07-000101

CONN SOCKET PGA 49POS GOLD

Preci-Dip
2,145 -

RFQ

510-87-049-07-000101

Технические

Bulk 510 Active PGA 49 (7 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-628-41-134191

114-87-628-41-134191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,149 -

RFQ

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-003101

116-83-316-41-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,310 -

RFQ

116-83-316-41-003101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-620-41-105101

117-87-620-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,105 -

RFQ

117-87-620-41-105101

Технические

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-322-31-012101

614-87-322-31-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,593 -

RFQ

614-87-322-31-012101

Технические

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-422-31-012101

614-87-422-31-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,652 -

RFQ

614-87-422-31-012101

Технические

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-220-10-001101

410-83-220-10-001101

CONN ZIG-ZAG 20POS GOLD

Preci-Dip
2,482 -

RFQ

410-83-220-10-001101

Технические

Bulk 410 Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-220-10-002101

410-83-220-10-002101

CONN ZIG-ZAG 20POS GOLD

Preci-Dip
2,453 -

RFQ

410-83-220-10-002101

Технические

Bulk 410 Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-318-41-001101

122-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,203 -

RFQ

122-87-318-41-001101

Технические

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-318-41-001101

123-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,819 -

RFQ

123-87-318-41-001101

Технические

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-312-41-105191

110-87-312-41-105191

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,488 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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