Разъемы для ИС, Транзисторов

Фото: Мфр. Часть # Доступность Цена Количество Технические Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-318-41-007101

116-87-318-41-007101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,092 -

RFQ

116-87-318-41-007101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-006101

116-87-422-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,930 -

RFQ

116-87-422-41-006101

Технические

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-636-41-001101

115-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,370 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-044-24-008

540-88-044-24-008

CONN SOCKET PLCC 44POS TIN

Preci-Dip
2,063 -

RFQ

540-88-044-24-008

Технические

Bulk 540 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
146-83-314-41-036101

146-83-314-41-036101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,205 -

RFQ

146-83-314-41-036101

Технические

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-007101

116-83-314-41-007101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,835 -

RFQ

116-83-314-41-007101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-328-41-001101

614-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,561 -

RFQ

614-87-328-41-001101

Технические

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-318-31-012101

614-83-318-31-012101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,299 -

RFQ

614-83-318-31-012101

Технические

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-624-41-001101

115-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,812 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-009101

116-87-316-41-009101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,165 -

RFQ

116-87-316-41-009101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-324-41-117101

114-83-324-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,387 -

RFQ

114-83-324-41-117101

Технические

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-324-41-134161

114-83-324-41-134161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,439 -

RFQ

114-83-324-41-134161

Технические

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-002101

116-83-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,851 -

RFQ

116-83-314-41-002101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-001101

116-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,156 -

RFQ

116-83-312-41-001101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-018101

116-87-424-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,225 -

RFQ

116-87-424-41-018101

Технические

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-018101

116-87-624-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,659 -

RFQ

116-87-624-41-018101

Технические

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-003101

116-83-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,617 -

RFQ

116-83-318-41-003101

Технические

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-012101

116-87-420-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,111 -

RFQ

116-87-420-41-012101

Технические

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-105101

110-83-320-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,703 -

RFQ

110-83-320-41-105101

Технические

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-324-31-012101

614-87-324-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,781 -

RFQ

614-87-324-31-012101

Технические

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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