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| Фото: | Мфр. Часть # | Доступность | Цена | Количество | Технические | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
40-6554-10CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics |
360 | - |
RFQ |
Технические |
Tube | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
24-6554-11CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics |
183 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
48-6554-10CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics |
320 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
28-6554-11CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics |
342 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
32-6554-11CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics |
103 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
0804MCCONN TRANSIST TO-3 8POS GOLD Texas Instruments |
245 | - |
RFQ |
Tray | - | Active | Transistor, TO-3 | 8 (Oval) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyester, Glass Filled | |
|
24-6554-16CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
209 | - |
RFQ |
Технические |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
232-5205-01CONN SOCKET QFN 32POS GOLD 3M |
2,291 | - |
RFQ |
Технические |
Bulk | Textool™ | Active | QFN | 32 (4 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
240-5205-01CONN SOCKET QFN 40POS GOLD 3M |
3,088 | - |
RFQ |
Технические |
Bulk | Textool™ | Active | QFN | 40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
2-2822979-3CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
147 | - |
RFQ |
Технические |
Tray | - | Active | LGA | 3647 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
210-47-308-41-001000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
1,576 | - |
RFQ |
Технические |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
ED020PLCZCONN SOCKET PLCC 20POS TIN On Shore Technology Inc. |
2,420 | - |
RFQ |
Технические |
Tube | ED | Active | PLCC | 20 (4 x 5) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
4832-6004-CPCONN IC DIP SOCKET 32POS TIN 3M |
1,424 | - |
RFQ |
Технические |
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
AR 06-HZL/07-TTCONN IC DIP SOCKET 6POS GOLD Assmann WSW Components |
5,609 | - |
RFQ |
Технические |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
8432-21A1-RK-TPCONN SOCKET PLCC 32POS TIN 3M |
1,052 | - |
RFQ |
Технические |
Tube | 8400 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
A-CCS 028-G-TCONN SOCKET PLCC 28POS GOLD Assmann WSW Components |
875 | - |
RFQ |
Технические |
Tube | - | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
114-87-318-41-134161CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
1,047 | - |
RFQ |
Технические |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
AR 24-HZL/01/7-TTCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
1,434 | - |
RFQ |
Технические |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
69802-044LFCONN SOCKET PLCC 44POS TIN Amphenol ICC (FCI) |
5,333 | - |
RFQ |
Технические |
Tube | - | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
D2822-42CONN IC DIP SOCKET 22POS GOLD Harwin Inc. |
1,083 | - |
RFQ |
Технические |
Tube | D2 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
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