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Разъемы для ИС, Транзисторов
| Фото: | Мфр. Часть # | Доступность | Цена | Количество | Технические | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
D2824-42CONN IC DIP SOCKET 24POS GOLD Harwin Inc. |
2,780 | - |
RFQ |
Технические |
Tube | D2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
AR 28-HZL/01-TTCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
1,148 | - |
RFQ |
Технические |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
4591CONN TRANSIST TO-5 4POS TIN Keystone Electronics |
2,132 | - |
RFQ |
Технические |
Bulk | - | Active | Transistor, TO-5 | 4 (Round) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled |
|
AR 16-HZL/07-TTCONN IC DIP SOCKET 16POS GOLD Assmann WSW Components |
1,976 | - |
RFQ |
Технические |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
111-43-320-41-001000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
212 | - |
RFQ |
Технические |
Tube | 111 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
917-43-210-41-005000CONN SOCKET TRANSIST TO100 10POS Mill-Max Manufacturing Corp. |
168 | - |
RFQ |
Технические |
Tube | 917 | Active | Transistor, TO-100 | 10 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
123-87-314-41-001101CONN IC DIP SOCKET 14POS GOLD Preci-Dip |
1,064 | - |
RFQ |
Технические |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-43-624-41-001000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
133 | - |
RFQ |
Технические |
Tube | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
214-44-628-01-670800CONN IC DIP SOCKET 28POS TIN Mill-Max Manufacturing Corp. |
219 | - |
RFQ |
Технические |
Tube | 214 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
382CONN IC DIP SOCKET 28POS Adafruit Industries LLC |
2,998 | - |
RFQ |
Технические |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | - | - | - | - | - | - | - | - | - | - | - | - |
|
XR2C-2011-NCONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
612 | - |
RFQ |
Технические |
Bulk | XR2 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
D2928-42CONN IC DIP SOCKET 28POS GOLD Harwin Inc. |
165 | - |
RFQ |
Технические |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
210-93-632-41-001000CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp. |
345 | - |
RFQ |
Технические |
Tube | 210 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
210-43-632-41-001000CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp. |
2,346 | - |
RFQ |
Технические |
Tube | 210 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
114-87-328-41-134161CONN IC DIP SOCKET 28POS GOLD Preci-Dip |
3,775 | - |
RFQ |
Технические |
Box | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-43-328-41-003000CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. |
251 | - |
RFQ |
Технические |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
22-4518-10CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
2,042 | - |
RFQ |
Технические |
Bulk | 518 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
115-93-628-41-003000CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. |
209 | - |
RFQ |
Технические |
Tube | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-93-328-41-003000CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. |
137 | - |
RFQ |
Технические |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
32-6518-10CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
889 | - |
RFQ |
Технические |
Tube | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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